About the assignment
Thermal management is an important aspect in the design of radar. Dedicated electronic Printed Circuit Board Assemblies are used throughout the entire system. A Printed Circuit Board (PCB) consists of a copper distribution network often on a glass fibre reinforced epoxy substrate (dielectric material), which transfers the signals of electrical components. These components generate heat as a by-product and need to be cooled. Due to various design constraints, components can usually only dissipate their heat towards the PCB they are mounted on. This means that by conductivity the heat is transported from the components through the PCB towards a (liquid) cooled heat sink. The thermal resistance of the PCB material is relatively high, which results in large temperature gradients through the PCB. Thermal vias or solid copper coins can be added to reduce the thermal resistance, but a limit is reached in current thermal concepts.
New, more capable concepts are required. One of the proposed solutions is to integrate liquid cooling inside the PCB, bypassing the thermal resistance of the glass/epoxy. Options are to let the fluid run against, inside or through the PCB. A parametric study is desired to find an engineering optimum considering the following requirements;
• Compatibility with established electronics functions, materials and processes
• Long term reliability assessment including failure mechanisms such as electrochemical corrosion
• Uniformity of temperature across the PCB
• Pressure drop
• Heat transfer potential
• Minimum impact on electrical distribution network
• Interconnection to (cooling)system
• Electro-Static Discharge ESD risks
At Thales Hengelo we have our own facility to produce PCBs. Ideally the proposed solution will be compatible with internal fabrication processes.
First, different options for fluids and channels will be investigated, based on literature study and help from specialists within the Thales company. A Computational Fluid Dynamics numerical model will be created to determine the performance and sensitivity of the most important parameters. In parallel, a reliability, material compatibility and system-impact study will be carried out. Together a proposition of an experimental setup will be made (internship) and carried out (Graduation), to validate the system.
The results of this research will consist of design parameters which can be used in future PCB integrated cooling concepts.
Foreseen activities include:
- Literature search on applications which integrate electrical and cooling in a single component,
- Compare various concepts for feasibility and their capabilities and limits,
- Design of a numerical model and experimental validation.
- Verification of the model,
- Report the activities, numerical model and design parameters in a detailed report.
Affinity and/or experience with Mechanical (Thermal) Engineering, Electrical Engineering, Physics, Material Sciences
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Please keep in mind that we can only consider students who are enrolled at a school or educational institution during the whole internship period for our internships and graduation assignments.
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